500℃ temperature cycle thin film stress measurement device FLX-2320-S
500℃ temperature cycle thin film stress measurement device FLX-2320-S
A measuring device capable of accurately measuring thin film stress non-contact and non-destructively within a temperature range from room temperature to 500°C. 【Features】 ○ Calculates the change in the radius of curvature of the substrate caused by the thin film applied. The radius of curvature is calculated from the reflection angle of a laser scanning across the substrate. By measuring the radius of curvature before and after the film application and calculating the difference, the change in the radius of curvature (R) can be determined. ○ The temperature inside the measurement chamber can be freely set, allowing for a more accurate understanding of thin film characteristics under actual process and IC operating conditions. ○ An option for measuring glass substrates is also available. ● For other functions and details, please contact us.
- Company：ヤマト科学
- Price：Other
